Evaluation of Cu/SnAg Microbump Bonding Processes for 3D Integration Using...
AbstractPurpose - 3D chip stacking is a key technology for 3D integration which two or more chips are stacked with vertical interconnection. In case of multi chip stacking with fine pitch microbump...
View ArticleEffect of minor additions of Fe on bulk alloy microstructure and tensile...
AbstractPurpose - This work investigates the effects of small additions (0.1 and 0.3 wt%) of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu lead-free solder...
View ArticleSAC 305 solder paste with carbon nanotubes. Part I. Investigation of the...
AbstractPurpose - The purpose of Part I is the manufacturing of the SAC 305 solder paste with multiwall carbon nanotubes (MWCNT) before and after their structure modification and also the influence...
View ArticleEffect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder
AbstractPurpose - To improve the properties of Sn-9Zn solder so as to meet the needs of requires of industrial applications.Design/methodology/approach - Accoring to the key requirments of...
View ArticleInterfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu...
AbstractPurpose - A new low-silver solder alloy Sn- x(1.0, 1.5, 2.0)Ag-0.3Cu-3.0Bi-0.05Er (wt.%) (SACBE) was proposed in our former study. The growth behaviours of interfacial IMC layer for Cu/SACBE/Cu...
View ArticleSurface finish effect on reliability of SAC 305 soldered chip resistors
AbstractPurpose - To assess the long term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic...
View ArticleFluidic aligned, dense SWNTs arrays as potential die adhesive and thermal...
AbstractPurpose - A simple, room temperature process was reported to fluidic assemble dense, vertically aligned SWNTs between two chips and connect them together. This technology has the potential...
View ArticleInterfacial Reaction of a Sn-3.0Ag-0.5Cu Thin Film during Solder Reflowing
AbstractPurpose - The purpose of this paper is to produce and investigate the interfacial reaction between Sn-3.0Ag-0.5Cu (SAC305) thin film and Cu substrate by solder reflow at various temperatures...
View ArticleSolidification and reliability of lead-free solder interconnection
AbstractPurpose - The reliability of lead-free solder interconnection is of great importance to electronics nowadays. Depending on the load applied, an interconnection failure may appear as creep...
View ArticleSolder Joint Degradation and Detection Using RF Impedance Analysis
AbstractPurpose - The paper aims to clarify the method of using RF impedance changes as an early indicator of degradation of solder joint. It proposes the mode of crack propagation in solder joint and...
View ArticleThe effect of micro via-in pad design on surface-mount assembly defects: Part...
AbstractPurpose - The purpose of this paper was to propose a solution procedure to minimize/eliminate voiding and spattering defects in the assembly of 0201 chip components with micro via-in pads and...
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